Technical Presentations

• #2021_04: Y. Shlepnev, Evaluation of S-Parameters Similarity with Modified Hausdorff Distance, 2021 IEEE 30st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS2021), October 19, 2021.
• #2021_03: A. Duffy, G. Zhang, Y. Shlepnev, Comparison of Interconnect Model Validation with FSV and SPS Metrics, IBIS Virtual Summit with DesignCon 2021, San Jose, California August 19, 2021.
• #2021_02: Y. Shlepnev, Analysis to Measurement Validation with S-Parameters Similarity Metric, IBIS Virtual Summit at 2021 Virtual 2021 IEEE EMC+SIPI Workshop August 12, 2021.
• #2021_01: A. Manukovsky, Y. Shlepnev, Z. Khasidashvili, Machine Learning Based Design Space Exploration and Applications to Signal Integrity Analysis of 112Gb SerDes Systems, 2021 IEEE 71st Electronic Components and Technology Conference (ECTC 2021), June 2021
• #2020_02: Y. Shlepnev, V. Heyfitch, Tutorial – Design Insights from Electromagnetic Analysis & Measurements of PCB & Packaging Interconnects Operating at 6- to 112-Gbps & Beyond, Tuesday, January 28, DesignCon 2020, Santa Clara Convention Center, Santa Clara, CA.
• #2020_01: A. Manukovsky, Y. Shlepnev, Z. Khasidashvili, E. Zalianski, Machine Learning Applications for COM Based Simulation of 112Gb Systems, Wednesday, January 29th, DesignCon 2020, Santa Clara Convention Center, Santa Clara, CA.
• #2019_04: A. Manukovsky, Y. Shlepnev, Measurement-assisted extraction of PCB interconnect model parameters with fabrication variations, 2019 IEEE 28st Conference on Electrical Performance of Electronic Packaging and Systems, Oct. 6-9, 2019, (EPEPS 2019), October 6-9, 2019, Montreal, Canada.
• #2019_03: Y. Damgaci, Y. Choi, C. Cheng, Y. Shlepnev, Simplify & Validate: A Single Structure Approach for Separate PCB Dielectric & Conductor Roughness Loss Characterization, DesignCon 2019, January 31st, 2019, Santa Clara Convention Center, Santa Clara, CA.
• #2019_02: A. Manukovsky, Y. Shlepnev, Effect of PCB Fabrication Variations on Interconnect Loss, Delay, Impedance & Identified Material Models for 56-Gbps Interconnect Designs, DesignCon 2019, January 30th, 2019, Santa Clara Convention Center, Santa Clara, CA, Best Paper Award Finalist.
• #2019_01: Y. Shlepnev, 112 Gbps - In and Out of Package Challenges - Design insights from electromagnetic analysis, Slides from Panel on 112-Gbps Package Challenges, DesignCon 2019, January 29th, 2019, Santa Clara Convention Center, Santa Clara, CA.
• #2018_04: Y. Shlepnev, Visual Electromagnetics of Interconnects, 2018 IEEE Symposium on Electromagnetic Compatibility, Signal and Power Integrity, August 1, 2018, Long Beach Convention Center, Long Beach, CA.
• #2018_03: M. Marin, Y. Shlepnev, Systematic approach to PCB interconnects analysis to measurement validation, 2018 IEEE Symposium on Electromagnetic Compatibility, Signal and Power Integrity, July 31, 2018, Long Beach Convention Center, Long Beach, CA - Best Symposium Paper Finalist.
• #2018_02: Y. Shlepnev, How Interconnects Work - The Easy Way, DesiignCon2018, Chiphead Theater, 2:15 - 3:15 AM, January 31st, 2018, Santa Clara, CA.
• #2018_01: M. Marin, Y. Shlepnev, 40 GHz PCB Interconnect Validation: Expectation vs. Reality, DesignCon2018, January 31st, 2018, Santa Clara, CA, Best Paper Award Winner.
• #2017_04: Y. Shlepnev, Unified approach to interconnect conductor surface roughness modelling, 2017 IEEE 26st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS2017), October 17, 2017, San Jose, CA - click here to download Power Point version with animation.
• #2017_03: Y. Shlepnev, High-Speed Digital Field Visualization of Currents and Crosstalk, SI Journal Webinar, August 15, 2017 - click here to download Power Point version with animation.
• #2017_02: Y. Shlepnev, A. Neves, Laminate Materials Characterization for High Speed Applications, SI Journal Webinar, May 17, 2017.
• #2017_01: Y. Choi, C. Cheng, Y. Damgaci, N. Godishala, Y. Shlepnev, Cost-effective PCB Material Characterization for High-volume Production Monitoring, DesignCon 2017, Santa Clara, CA, Best Paper Award Winner.
• #2016_02: Y. Shlepnev, Y. Choi, C. Cheng, Y. Damgaci , Drawbacks and Possible Improvements of Short Pulse Propagation Technique, EPEPS 2016, San Diego, CA.
• #2016_01: C. Nwachukwu, Y. Shlepnev, S. McMorrow, A MATERIAL WORLD: Modeling dielectrics and conductors for interconnects operating at 10-50 Gbps, Tutorial at DesignCon2016, January 19, 2016, Santa Clara, CA.
• #2015_04: Y. Shlepnev, Broadband material model identification with GMS-parameters,Presentation at 2015 IEEE 24st Conference on Electrical Performance of Electronic Packaging and Systems, October 25-28, 2015, San Jose, CA.
• #2015_03: Closing the loop: What do we do when measurements and simulations don't match? - panel discussion hosted by Martin Rowe with panelists: D. Burnes, S. McMorrow, A. Neves, H. Barnes, S. Pytel, Y. Shlepnev, DesignCon2015, January 29, 2015.
• #2015_02: Y. Shlepnev, Sink or swim at 28 Gbps: How to validate interconnect analysis software for 28 Gbps data links, January 30, IBIS Forum at DesignCon2015. © 2015 Simberian Inc.
• #2015_01: J. Mallon, Y. Shlepnev, S-parameter Quality Metrics and Analysis to Measurement Correlation, DesignCon2015, January 29, 2015. © 2015 Anritsu & Simberian Inc.
• #2014_06: Guide to CMP-28/32 Simbeor Kit, CMP-28 Rev. 4, Sept. 2014.
• #2014_05: Y. Shlepnev, C. Nwachukwu, Modelling jitter induced by fibre weave effect in PCB dielectrics, Presentation from 2014 IEEE International Symposium on Electromagnetic Compatibility, Raleigh, NC, USA, August, 2014. © 2014 Isola & Simberian Inc.
• #2014_04: Y. Shlepnev, S-Parameter Quality Metrics, presentation from ANRITSU Signal Integrity Symposium, Santa Clara and Newport Beach, CA, July 2014. © 2014 Simberian Inc.
• #2014_03: Y. Shlepnev, Getting Simulations to Match Measurements (simulation outlook), presentation from ANRITSU Signal Integrity Symposium, Santa Clara and Newport Beach, CA, July 2014. © 2014 Simberian Inc.
• #2014_02: Y. Shlepnev, Dielectric and conductor roughness model identification for successful PCB and packaging interconnect design up to 50 GHz, presentation from DesignCon 2014 © 2014 Simberian Inc.
• #2014_01: W. Beyene, Y.-C. Hahm, J. Ren, D. Secker, D. Mullen, Y. Shlepnev, Lessons learned: How to Make Predictable PCB Interconnects for Data Rates of 50 Gbps and Beyond, presentation from DesignCon 2014 © 2014 Rambus & Simberian Inc., Best Paper Award Finalist.
• #2013_03: Y. Shlepnev, "Design Insights from Electromagnetic Analysis of Interconnects", presented at Front Range Signal Integrity (FRSI) seminar on October 3, 2013, Longmont, CO. © 2013 Simberian Inc.
• #2013_02: Y. Shlepnev, Decompositional analysis of diginal interconnects, - 2013 IEEE International Symposium on Electromagnetic Compatibility (EMC2013), Denver, CO, USA, August 7, 2013. © 2013 Simberian Inc.
• #2013_01: Y. Shlepnev, Elements of Decompositional Electromagnetic Analysis of Interconnects, Tutorial, DesignCon2013. Santa Clara, CA. © 2013 Simberian Inc.
• #2012_01: Y. Shlepnev, C. Nwachukwu, Practical methodology for analyzing the effect of conductor roughness on signal losses and dispersion in interconnects, DesignCon2012 Santa Clara, CA. © 2012 Simberian Inc. & Isola Group USA, Best Paper Award Finalist
• #2011_06: Y. Shlepnev, Quality of S-parameter models, 2011 IBIS Summit, Yokohama, November 18, 2011. Translation in Japaneese is available here.
• #2011_05: Y. Shlepnev, C. Nwachukwu, Roughness characterization for interconnect analysis. - 2011 IEEE International Symposium on Electromagnetic Compatibility, Long Beach, CA, USA, August 17, 2011. © 2011 Simberian Inc. & Isola Group USA
• #2011_04: Y. Shlepnev, S. McMorrow, Nickel characterization for interconnect analysis. - 2011 IEEE International Symposium on Electromagnetic Compatibility, Long Beach, CA, USA, August 17, 2011. © 2011 Simberian Inc. & Teraspeed Consulting Group
• #2011_04: Y. Shlepnev, Reflections on S-parameter Quality, DesignCon 2011 IBIS Summit, Santa Clara, February 3, 2011.
• #2011_03: D. Dunham, J. Lee, S. McMorrow, Y. Shlepnev, Design and Optimization of a Novel 2.4 mm Coaxial Field Replaceable Connector Suitable for 25 Gbps System and Material Characterization up to 50 GHz, DesignCon 2011, Santa Clara, February 2, 2011.
• #2011_01: Y. Shlepnev, How to Avoid Butchering S-parameters, DesignCon 2011, Santa Clara, February 1, 2011.
• #2010_03: Y. Shlepnev, Quality Metrics for S-parameter Models, DesignCon 2010 IBIS Summit, Santa Clara, February 4, 2010.
• #2010_02: Y. Shlepnev, A. Neves, T. Dagostino, S. McMorrow, Practical Identification of Dispersive Dielectric Models with Generalized Modal S-parameters for Analysis of Interconnects in 6-100 Gb/s Applications, DesignCon 2010, Santa Clara, February 3, 2010.
• #2010_01: H. Barnes, Y. Shlepnev, J. Nadolny, T. Dagostino, S. McMorrow, Quality of High Frequency Measurements: Practical Examples, Theoretical Foundations, and Successful Techniques that Work Past the 40GHz Realm, Tutorial materials from DesignCon 2010, Santa Clara, February 1, 2010.
• #2009_02: Y. Shlepnev, Primer of mixed-mode transformations in differential interconnects, DesignCon 2009 IBIS Summit, Santa Clara, February 5, 2009.
• #2009_01: Y. Shlepnev, A. Neves, T. Dagostino, S. McMorrow, Measurement-Assisted Electromagnetic Extraction of Interconnect Parameters on Low-Cost FR-4 boards for 6-20 Gbps Applications, DesignCon 2009, Santa Clara, February 4, 2009, Best Paper Award Winner.
• #2008_01: Y. Shlepnev, Building advanced transmission line and via-hole models for serial channels with 10 Gbps and higher data rates, DesignCon IBIS Summit, Santa Clara, February 7, 2008.
• #2007_02: Y. Shlepnev, Building advanced via-hole models for analysis of PCB interconnects, PCB Design Conference East, Durham NC, October 24, 2007.
• #2007_01: Y. Shlepnev, Broadband transmission line models for analysis of serial data channel interconnects, PCB Design Conference East, Durham NC, October 23, 2007.